发明名称 CURABLE RESIN COMPOSITION, AND COMPOSITION FOR HARD COAT
摘要 The present invention provides a curable resin composition excellent in dispersion stability and capable of bettering various physical properties of hard coating films to be formed through curing, without requiring surface treatment of inorganic microparticles of silica or the like and use of dispersant. The curable resin composition contains an alkylene oxide-modified dipentaerythritol (meth)acylate and, as dispersed therein, surface-untreated inorganic microparticles having a mean particle size of from 1 to 150 nm. A ratio of inorganic microparticles in a total weight of these is from 10 to 45% by weight and a content of solvent is 1% by weight or less.
申请公布号 US2016244634(A1) 申请公布日期 2016.08.25
申请号 US201415024219 申请日期 2014.09.08
申请人 DAI-ICHI KOGYO SEIYAKU CO., LTD. 发明人 TAKAMURA Naohiro
分类号 C09D171/00;C08K3/36;C09D7/12 主分类号 C09D171/00
代理机构 代理人
主权项 1. A curable resin composition comprising an alkylene oxide-modified dipentaerythritol (meth)acrylate having a structure represented by the following general formulae (I) and (II), and, as dispersed therein, surface-untreated inorganic microparticles having a mean particle size of from 1 to 150 nm, wherein a ratio of the inorganic microparticles in a total weight of these is from 10 to 45% by weight and a content of a solvent is 1% by weight or less: wherein in the general formula (I), R represents a substituent represented by the general formula (II), AO indicates one kind or two or more kinds selected from alkylene oxide units represented by —CH2CH2O—, —CH2CH(CH3)O—, —CH2CH2CH2CH2O—, and —CH2CH(C2H5)O—, L indicating a mean degree of polymerization of added alkylene oxide chains is 0<L≦5, a mean value of m is more than 0 and 5 or less, a mean addition molar number L×m of alkylene oxides is 0<L×m≦5, n is 1 or 2, a mean value of o is 0 or more and 6 or less, and a total value of m, n and o is 6; and in the general formula (II), R2 represents a hydrogen atom or a methyl group.
地址 Kyoto JP