| 摘要 |
PROBLEM TO BE SOLVED: To provide a back grind-underfill integrated tape which ensures electrode bonding with excellent connectibility and excellent reliability after bonding, and to provide a mounting method of a semiconductor chip using the back grind-underfill integrated tape.SOLUTION: A back grind-underfill integrated tape comprises a thermosetting resin layer, a bump protective layer, and a base material layer in this order, and satisfies the following formula (1) 1.09×Bh≤Uh+Ph<1.5×Bh, where Bh is average height of bumps of a semiconductor chip to be sealed, Uh is thickness of the thermosetting resin layer, and Ph is thickness of the bump protective layer. |
