| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface mounting component which increases the receptivity for warpage of a substrate when a component is mounted, simplifies coplanarity management of a connector, and prevents the occurence of solder defects. <P>SOLUTION: A surface mount component C of this invention includes multiple leads 2, each of which has a body part 2a and a leg part 2b, solder accumulation parts 3, each of which is formed so as to have a top part at an electrical connection surface 2ba of the leg part 2b, and diffusion prevention parts 2c, each of which prevents solder forming the solder accumulation part 3 from diffusing along the lead. <P>COPYRIGHT: (C)2012,JPO&INPIT |
