发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor apparatus for suppressing charge damage on a gate insulating film even when the dry etching to form wiring progresses. SOLUTION: The method comprises the steps of forming a first conductive film 11 on an insulating film 8, forming a second conductive film 12 on or above the first conductive film 11, forming a mask film 50 on or above the second conductive film 12, patterning the second conductive film 12 by drying etching the second conductive film 12 with the mask film 50 used as a mask and the first conductive film 11 as a stopper, and patterning the first conductive film 11 by etching the first conductive film 11 with the mask film 50 and the second conducive film 12 used as a mask. A wiring pattern is formed with the steps of patterning the second conductive film 12 and the first conductive film 11. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006344784(A) 申请公布日期 2006.12.21
申请号 JP20050169374 申请日期 2005.06.09
申请人 SEIKO EPSON CORP 发明人 KASAI ATSUSHI;ITO TARO;IWAI KAZUO
分类号 H01L21/3213;H01L21/3205;H01L21/768;H01L23/52 主分类号 H01L21/3213
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