| 摘要 |
PROBLEM TO BE SOLVED: To restrain an increase in the area of a semiconductor integrated circuit, and to reduce the effect of crosstalk noise. SOLUTION: In the semiconductor integrated circuit having a multilayer interconnection structure, a power wiring layer 101 for supplying power is provided between signal wiring layers 102, 103, and there are signal wiring for electrically connecting the signals of the signal wiring layers 102, 103 above and below the power wiring layer 101 and a via hole 140 for preventing the power wiring layer 101 from being connected to the signal wiring electrically inside the power wiring layer 101, thus allowing the power wiring layer to show a shield effect, restraining the effect of the crosstalk noise that the signal wiring receives, allowing the via hole provided on the power wiring layer in advance to increase the flexibility in general signal wiring, and restraining an increase in a chip size for reducing the crosstalk noise. COPYRIGHT: (C)2007,JPO&INPIT
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