发明名称 |
Protection layer for adhesive material at wafer edge |
摘要 |
A wafer is attached to a carrier by using an adhesive layer, and a portion of the adhesive layer is exposed adjacent to an edge of the wafer. After thinning the wafer, a protection layer is provided to cover the exposed portion of the adhesive layer. A plurality of dies is bonded onto the thinned wafer, and then the thinned wafer and the dies are encapsulated with a molding compound.
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申请公布号 |
US8252665(B2) |
申请公布日期 |
2012.08.28 |
申请号 |
US20100769725 |
申请日期 |
2010.04.29 |
申请人 |
CHIOU WEN-CHIH;WU WENG-JIN;SHUE SHAU-LIN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHIOU WEN-CHIH;WU WENG-JIN;SHUE SHAU-LIN |
分类号 |
H01L21/30;H01L21/46 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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