| 摘要 |
PROBLEM TO BE SOLVED: To reduce a push-in quantity of a break blade when dividing a substrate.SOLUTION: A scribe line S is formed in advance on one glass substrate 11 among two brittle material substrates stuck together by an adhesive layer 12, and a constant width groove 14 is formed on the other silicon substrate 13 along its scribe line S. A break blade 23 is pushed down from the groove 14 side, so that the break blade 23 contacts with a corner part of the groove 14, and the contact area of the break blade is reduced, and a push-in quantity is reduced, and a break can be executed.SELECTED DRAWING: Figure 4 |
