EXPOSURE APPARTUS AND RETICLE FORMING METHOD THEREOF

摘要

According to an embodiment of the present invention, a reticle forming method of an exposure device comprises the following steps of: forming patterns of core regions of at least two chips; and forming patterns of peripheral regions of the at least two chips. The patterns of the core regions are arranged to face each other or the patterns of the peripheral regions are arranged to face each other. Therefore, the method can improve a chip yield of a wafer.