A PRINTED CIRCUIT BOARD COMPRISING EMBEDED ELECTRONIC COMPONENT WITHIN AND A METHOD FOR MANUFACTURING

摘要

According to the present invention, a board having an embedded electronic component comprises: a multilayered substrate including an insulation layer and inner circuit layers laminated therein; a via formed on the insulation layer and electrically connected by connecting the inner circuit layers to each other; a cavity formed on one surface of the multilayered substrate; a first electronic component inserted into the cavity; and a bump pad formed on a surface of the cavity facing the first electronic component. An electronic component, in which the first electronic component is laterally mounted in the cavity, is provided to realize miniaturization and multi-functionality of a printed circuit board.