| 发明名称 |
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
Provided is a sheet for sealing in which a semiconductor chip is to be embedded, and a surface of the sheet has a surface specific resistance value of 1.0×1012Ω or less. |
| 申请公布号 |
US2016237288(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201414912866 |
申请日期 |
2014.07.18 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
Shiga Goji;Mizuno Koji |
| 分类号 |
C09D5/24 |
主分类号 |
C09D5/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sheet for sealing in which a semiconductor chip is to be embedded,
a surface of the sheet having a surface specific resistance value of 1.0×1012Ω or less. |
| 地址 |
Ibaraki-shi, Osaka JP |
