Optical connection techniques and configurations

摘要

Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed.

主权项

1. A method, comprising:
depositing solder interconnect material to facilitate attachment of components to a surface of a package substrate; positioning the components for attachment to the package substrate, the components including at least an optoelectronic assembly configured to emit and/or receive optical signals in a form of light, and a receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned to route the light when the optical coupler plug is plugged into the receptacle; and reflowing the deposited solder interconnect material to form a bond between the components and the package substrate, which includes forming electrical interconnect structures that electrically couple the optoelectronic assembly with the package substrate and forming dummy interconnect structures that structurally couple the receptacle with the package substrate.