发明名称 |
Herstellung eines optoelektronischen Bauelements |
摘要 |
A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic semiconductor chips on a carrier and commonly compressing separate molding compounds in areas of the optoelectronic semiconductor chips, wherein separate molded bodies are formed in the areas of the optoelectronic semiconductor chips. |
申请公布号 |
DE112014004745(A5) |
申请公布日期 |
2016.10.27 |
申请号 |
DE20141104745T |
申请日期 |
2014.10.14 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Pindl, Markus;Jerebic, Simon;Geltl, Tobias |
分类号 |
H01L33/52;H01L25/075;H01L33/50;H01L33/54;H01L33/60 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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