| 摘要 |
PROBLEM TO BE SOLVED: To reduce a first lead-out wiring 20a led out from a vibration part 10, and electrostatic capacitance caused by a second lead-out wiring 20b, in a piezoelectric device of such a structure that a piezoelectric chip having a vibration part 12 and a frame 14 surrounding it is sandwiched by a base and a lid.SOLUTION: A portion 20ab on the frame 14 of the first lead-out electrode 20a is provided on the inner peripheral side of the first principal surface of the frame, and a portion 20bb on the frame 14 of the second lead-out electrode 20b is provided on the side (outer peripheral side of the frame 14) of the second principal surface of the frame 14 not facing the first lead-out electrode 20ab. Furthermore, a portion 20aa on a coupling part 16 of the first lead-out electrode 20a is provided in the half region of the first principal surface of the coupling part in the width direction, and on the second principal surface of the coupling part, the second lead-out electrode is provided in the half region of the coupling part in the width direction not facing the first lead-out electrode.SELECTED DRAWING: Figure 1 |
