发明名称 半導体装置とその製造方法
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device.SOLUTION: The present invention provides a semiconductor device that comprises a first conductivity type of substrate having an active region and a termination region; a first conductivity type of an epitaxial layer on the substrate; a plurality of first and second trenches in the epitaxial layer; an implantation block layer formed on bottom parts of the first and second trenches; a liner having the second conductivity differing from the first conductivity type and conformally formed along side walls of the first and second trenches; a dielectric material filled in the first and second trenches defining a plurality of first and second columns respectively; a gate dielectric layer on the epitaxial layer; two floating gates formed on the gate dielectric layer; a source region; an interlayer insulation film layer; and a contact plug formed on the source region.
申请公布号 JP6046072(B2) 申请公布日期 2016.12.14
申请号 JP20140059590 申请日期 2014.03.24
申请人 世界先進積體電路股▲ふん▼有限公司 发明人 ラーフル クマール;マノジ クマール;許 健;楊 紹明;ルディ オクタビィアス シホンビン;李 家豪;杜 尚暉
分类号 H01L29/78;H01L29/06 主分类号 H01L29/78
代理机构 代理人
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