发明名称 |
JOINING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To enable resin surfaces to be joined to each other at lower temperatures which are temperatures of a glass transition point or lower by flattening a joint surface and lowering a molecular weight of the joint surface.SOLUTION: A method for joining resin surfaces each other includes: a step of flattening and softening joint surfaces of base materials 11 and 12 by irradiating the joint surfaces with high energy; and a step of heating and/or pressurizing the base materials 11 and 12 after having brought the joint surfaces into contact with each other, and joining the base materials each other.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016210126(A) |
申请公布日期 |
2016.12.15 |
申请号 |
JP20150096915 |
申请日期 |
2015.05.11 |
申请人 |
TOYO SEIKAN GROUP HOLDINGS LTD |
发明人 |
KUNINORI MASAHIRO;ONUKI RYUJI;IWASAKI TSUTOMU |
分类号 |
B29C65/02;B01J19/00;B81C3/00 |
主分类号 |
B29C65/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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