发明名称 JOINING METHOD
摘要 PROBLEM TO BE SOLVED: To enable resin surfaces to be joined to each other at lower temperatures which are temperatures of a glass transition point or lower by flattening a joint surface and lowering a molecular weight of the joint surface.SOLUTION: A method for joining resin surfaces each other includes: a step of flattening and softening joint surfaces of base materials 11 and 12 by irradiating the joint surfaces with high energy; and a step of heating and/or pressurizing the base materials 11 and 12 after having brought the joint surfaces into contact with each other, and joining the base materials each other.SELECTED DRAWING: Figure 2
申请公布号 JP2016210126(A) 申请公布日期 2016.12.15
申请号 JP20150096915 申请日期 2015.05.11
申请人 TOYO SEIKAN GROUP HOLDINGS LTD 发明人 KUNINORI MASAHIRO;ONUKI RYUJI;IWASAKI TSUTOMU
分类号 B29C65/02;B01J19/00;B81C3/00 主分类号 B29C65/02
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