发明名称 Method of forming metal fine particle pattern and method of forming electroconductive pattern
摘要 <p>The present invention provides: a method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.</p>
申请公布号 EP1508453(A2) 申请公布日期 2005.02.23
申请号 EP20040019819 申请日期 2004.08.20
申请人 FUJI PHOTO FILM CO., LTD. 发明人 KANOU, TAKEYOSHI;KAWAMURA, KOICHI
分类号 G03F7/095;G03F7/004;B41M3/00;B41M5/36;G03F7/038;G03F7/26;G03F7/38;G03F7/40;H05K3/10;H05K3/18;(IPC1-7):B41M3/00 主分类号 G03F7/095
代理机构 代理人
主权项
地址