| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in chemical resistance (plating resistance), adhesion, mechanical strength and flexibility, to obtain a photosensitive element using the photosensitive resin composition and to produce a resist pattern and a printed circuit board. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerization initiator and (C) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule. The component C includes a compound having at least one urethane bond in one molecule and a polyalkylene glycol di (meth)acrylate compound having at least two kinds of alkylene oxide groups in one molecule. A circuit forming substrate with a resist pattern produced using the photosensitive resin composition is etched or plated to produce the objective printed circuit board. |
