| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device capable of inspecting collectively a plurality of semiconductor elements having a narrow pitch of electrode structure. SOLUTION: In this probe card having a probe sheet 4 having a contact terminal 4a contacting with an electrode 3 provided in a wafer 1, a guiding wire 4c drawn out of the contact terminal 4a, and an electrode 4d connected electrically to the guiding wire 4c, and a multilayered wiring board 50 having an electrode 50a connected electrically to the electrode 4d of the probe sheet 4, the contact terminal 4a contacts with the electrode 3 in the wafer 1 with one or a plurality of bonding holders 5 for applying pressurizing force onto a terminal group via a pressing block 5b having a spring 5a to contact with the electrode 3, from a backface of the terminal group of the contact terminal 4a. The probe card 4 is bonded to the each bonding holder 5, and the bonding holders 5 are combined to constitute a device for inspecting simultaneously a large number of chips. COPYRIGHT: (C)2007,JPO&INPIT
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