| 摘要 |
PROBLEM TO BE SOLVED: To properly bond a plurality of chips arranged on a substrate with the substrate.SOLUTION: A bonding device includes: a processing chamber for storing a wafer W; a table 150 provided inside the processing chamber, for holding the wafer by suction; a heating mechanism 156 provided in the table 150, for heating the wafer W; a vacuum line 152 provided in the table 150, for sucking the wafer W by vacuuming; an electrode 155 provided in the table 150, for electrostatically sucking the wafer W; and a gas supply mechanism for supplying a pressurized gas to the inside of the processing chamber. In the bonding device, after the wafer W is sucked on the table 150 by vacuuming by the vacuum line 152, voltage is applied to the electrode 155 to make the wafer W be electrostatically sucked on the table 150. Subsequently, the inside of the processing chamber is pressured by the pressurized gas supplied from the gas supply mechanism and the wafer W and a plurality of chips are bonded.SELECTED DRAWING: Figure 8 |
