METAL BONDED SUBSTRATE

摘要

The present invention relates to a metal-bonded substrate and, more specifically, to a metal-bonded substrate in which the bonding force between a non-conductive substrate and a metal layer bonded to each other is remarkably improved. Accordingly, the present invention provides a metal-bonded substrate, comprising: a substrate; a metal layer formed on the substrate; and a self-assembled monomolecular layer formed between the substrate and the metal layer and composed of a silane chemically linking the substrate and the metal layer, wherein the end group of the silane is composed of an aminosilane containing a saturated or unsaturated hetero atom of a six-membered ring.