| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for electrically connecting two substrates without generating a contact of adjacent bumps.SOLUTION: A method is for connecting a first substrate and a second substrate. The first substrate includes a first electrode surface in which a plurality of first electrodes is linearly disposed with a space, the second substrate includes a second electrode surface in which a plurality of second electrodes is linearly disposed with the space, and a second bump having a volume different from a first bump is alternately disposed on the second electrode. The first electrode surface and the second electrode surface are faced so that the first bump and the second electrode at which the second bump is not disposed are faced, and the second bump and the first electrode at which the first bump is not disposed are faced. The plurality of first bumps on the first electrode surface and the plurality of second electrodes on the second electrode surface are contacted, and the plurality of second bumps on the second electrode surface and the plurality of first electrodes on the first electrode surface are contacted to connect the first substrate and the second substrate.SELECTED DRAWING: Figure 5 |
