| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding materials together.SOLUTION: A method of bonding materials 14, 18 together comprises defining a bond interface 22 between two materials 14, 18 in a cure zone on a surface 16 of an object 12 and heating the bond interface 22 with sound waves. Heating the bond interface 22 may include applying ultrasonic sound waves to the bond interface 22. The method includes arranging a thermosetting adhesive between the two materials 14, 18.SELECTED DRAWING: Figure 1 |
