发明名称 |
System, fremgangsmåde og apparat til impulsmoduleret induktionsopvarmning til fjernelse af komponenter fra samlede strukturelle dele |
摘要 |
A pulsed induction heating system removes bonded elements from underlying substrates. A coil loop of a tool fits around the base of the clement to be removed. The tool heats the element and the substrate in short pulses that are followed by brief, non-heated wait periods. The temperature of the substrate is measured during the wait periods between pulses to avoid overheating. When the substrate reaches a target temperature, the adhesive is sufficiently softened such that the element and adhesive are readily scraped off without damaging the substrate. |
申请公布号 |
DK2205042(T3) |
申请公布日期 |
2012.09.24 |
申请号 |
DK20090180743T |
申请日期 |
2009.12.24 |
申请人 |
LOCKHEED MARTIN CORPORATION |
发明人 |
SEEGMILLER, NEAL, A.;STREET, STUART, C. |
分类号 |
H05B6/02;H05B6/14;H05B6/36;H05B6/40 |
主分类号 |
H05B6/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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