Flip chip die bond pads, die bond pad placement and routing optimization

摘要

An integrated circuit die for a flip chip has circular die bond pads. Circular die bond pads allows for a higher density of bond pads when a mating printed circuit board has routing lines between its corresponding pads. In one form, there is provided a flip chip having a die and a plurality of die bond pads situated on the die. Each die bond pad of the die is circular.