| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem accompanying a conventional method for metallization of a non-conductive substrate, wherein deposits are formed on members of a facility due to salt precipitation. SOLUTION: In the method, (a) the substrate is contacted with a metal-containing activator solution, (b) the substrate contacted with the metal-containing solution is subsequently contacted with a metal salt solution comprising (1) a metal salt containing at least one metal reduced by a metal in the activator solution and (2) a reagent that forms a complex with at least one metal chosen from lithium, sodium, potassium, rubidium and cesium, and (c) the treated substrate is coated with a metal through electroless plating or electroplating, wherein the metal salt comprises lithium, sodium, potassium, rubidium and cesium in the forms of salts chosen from a group consisting of fluorides, chlorides, iodides, bromides, nitrates, sulfides and mixtures thereof. COPYRIGHT: (C)2007,JPO&INPIT
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