发明名称 FLAME RETARDANT ADHESIVE COMPOSITION, AND ADHESIVE SHEET, COVERLAY FILM AND FLEXIBLE COPPER-CLAD LAMINATE PLATE, USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a halogen-free adhesive composition yielding a cured product, on curing, that exhibits excellent flame retardancy and electric property (anti-migration properties), and to provide an adhesive sheet, a cover lay film, and a flexible copper-clad laminate plate, using the composition. SOLUTION: The flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator is provided. Also provided are an adhesive sheet having a layer including the composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the composition provided on the film; a flexible copper-clad laminate plate having an electrically insulating film, a layer comprising the composition and provided on the film, and a copper foil; a process for producing the adhesive sheet; a process for producing the coverlay film; and a process for producing the flexible copper-clad laminate plate. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006342333(A) 申请公布日期 2006.12.21
申请号 JP20060106422 申请日期 2006.04.07
申请人 SHIN ETSU CHEM CO LTD 发明人 NAKANISHI NOBORU;KONDO KAZUNORI;HOSHIDA SHIGEHIRO;AMANO TADASHI
分类号 C09J163/00;C09J7/02;C09J11/04;C09J113/00;C09J133/00;C09J167/00;C09J171/10;H05K1/03;H05K3/28 主分类号 C09J163/00
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