| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system with a new constitution improving the distribution of film thickness on a substrate. SOLUTION: In the sputtering system equipped with: a vacuum vessel; a substrate holder arranged in the vacuum vessel; and a plurality of sputtering cathodes each having a target of performing sputtering to a substrate mounted on the substrate holder, regarding the central axis of the target mounted on each sputtering cathode is arranged so as to be tilted at a prescribed angle to the central axis of the substrate mounted on the substrate holder, further, a sputtering cathode unit composed of the plurality of sputtering cathodes is held freely rotatably with the central axis of the substrate as the center to the vacuum vessel. COPYRIGHT: (C)2007,JPO&INPIT
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