COATING FOR A MOULD FOR ENCAPSULATING ELECTRONIC COMPONENTS

摘要

The present invention relates to a coating for a mould for encapsulating electronic components, which composition comprises a nickel/chrome compound wherein the weight ratio of nickel/chrome preferably lies between 20/80 and 80/20 % by weight. The invention also relates to a mould provided with such a coating for feeding encapsulating material to a mould cavity for the purpose of encapsulating electronic components, and to a device intended for this purpose.