| 摘要 |
An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which is covered or plated with a conductive material at least in some areas. One or more vias also extend between the top and bottom surfaces of the cut-out and are exposed along the edge. A field effect transistor is placed in the cut-out and into contact with a heat sink element designed to enhance grounding of the field effect transistor and improve the transfer of heat to the chassis or other metal support structure for the printed wiring board.
|
