MANUFACTURING METHOD OF THIN FILM CAPACITOR-INCORPORATING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a thin film capacitor-incorporating wiring board capable of minimizing damage of a dielectric film for a thin film capacitor, by improving a transfer step using a laser lift-off step. SOLUTION: The present invention provides a manufacturing method of a thin film capacitor-incorporating wiring board including the steps of: forming a sacrifice layer on a first substrate; forming a dielectric film on the sacrifice layer; forming a first electrode layer on the dielectric film; disposing the first substrate on the second substrate so that the first electrode layer is bonded to the upper surface of the second substrate; decomposing the sacrifice layer by irradiating the sacrifice layer with laser beams through the first substrate; separating the first substrate from the second substrate; and forming the second electrode layer on the dielectric film. COPYRIGHT: (C)2008,JPO&INPIT