SUBSTRATE WITH THIN FILM, METHOD FOR MACHINING THIN FILM, PIEZOELECTRIC DEVICE, AND METHOD FOR ADJUSTING FREQUENCY OF PIEZOELECTRIC VIBRATOR

摘要

PROBLEM TO BE SOLVED: To efficiently machine a thin film formed on a surface of a substrate with a laser beam transmitted through the substrate while suppressing damage to the substrate from the laser beam.

SOLUTION: With an interlayer 12 transparent to a laser beam 1 interposed between a substrate 11 transparent to the laser beam 1 and a first thin film 13 to be machined, the surface of the substrate 11 opposite to the side where the first thin film 13 is formed is irradiated with the laser beam 1, which is transmitted therethrough and focused on the first thin film 13 to machine the first thin film 13 and a second thin film 14. The interposition of the interlayer 12 between the substrate 11 and the first thin film 13 shifts the focus position of the laser beam 1 (the position of the first thin film 13) away from the substrate 11 by the thickness and keeps the substrate 11 from exposure to a high density region of the laser beam 1 to suppress damage to the substrate 11 from the laser beam 1 and resultant absorption (attenuation) of the laser beam 1 into the substrate 11.

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