| 摘要 |
PROBLEM TO BE SOLVED: To provide a testing apparatus configured to be smaller and simpler than the conventional art that can measure a semiconductor device with high accuracy with the device heated up to a desired temperature.SOLUTION: A testing apparatus 1 for heating up a semiconductor device 2 for testing the semiconductor device 2 comprises: a mounting part 3 on which the semiconductor device 2 is mounted; a heat source part 15 for heating up the semiconductor device 2; and a movable part 10 which moves to come into contact with an upper end face of the semiconductor device 2 mounted on the mounting part, and heats up the semiconductor device 2. The heat source part 15 includes a halogen lamp 23, and emits infrared from the halogen lamp 23 to the movable part 10. The movable part 10 comprises: a thermal conduction plate 32 that comes into contact with the upper end face of the semiconductor device 2 mounted on the mounting part 3, is heated up by infrared from the heat source part 15, and heats up the semiconductor device 2 through thermal conduction; and a light condensing dome 31 that reflects the infrared from the heat source part 15 and condenses the infrared on the thermal conduction plate 32.SELECTED DRAWING: Figure 3 |
