发明名称 |
発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法 |
摘要 |
There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal. |
申请公布号 |
JP5944142(B2) |
申请公布日期 |
2016.07.05 |
申请号 |
JP20110243464 |
申请日期 |
2011.11.07 |
申请人 |
三星電子株式会社Samsung Electronics Co.,Ltd. |
发明人 |
キム、ジョー ヨン;チョイ、スン キ;ホン、ジェ フン |
分类号 |
H01L21/56;H01L23/29;H01L23/31;H01L33/52 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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