| 摘要 |
Provided is a photosensitive resin composition that, despite having high sensitivity, can improve cohesion between a pattern curing film and metal wiring subsequent to a reflow process in a pattern curing film of a semiconductor device. This photosensitive resin composition is characterized by containing: at least one alkali-soluble resin selected from (a-1) resins principally containing a structure represented by general formula (1), (a-2) polyimides, and copolymers of these; and (c) a compound principally containing a structure represented by general formula (2). |
