| 摘要 |
A kit which can suppress residue from a temporary adhesive in semiconductor manufacturing, and a laminate body are provided. This kit for semiconductor device manufacture is provided with a composition containing a solvent A, a composition containing a solvent B, and a composition containing a solvent C. This kit is used in cases in which, after using a temporary adhesive composition containing a temporary adhesive and the solvent A to form a temporary adhesive layer on a first substrate, at least part of the remaining temporary adhesive on the first substrate is cleaned using the composition containing the solvent B, a laminate body is produced by bonding the first substrate and a second substrate with the temporary adhesive layer interposed therebetween, and thereafter, either the first substrate or the second substrate is separated from the laminate body at a temperature of less than 40°C and the temporary adhesive remaining on the first substrate and/or the second substrate is cleaned using the composition containing the solvent C. The solvent A, the solvent B and the solvent C each fulfill a prescribed vapor pressure and saturation solubility. |
