Integrated circuit device substrates having packaged inductors thereon

摘要

An integrated circuit device includes an integrated circuit substrate having an at least two piece package thereon. The package has a sealed cavity therein and a patterned metal inductor in the cavity. The inductor has at least a first terminal electrically coupled to a portion of the integrated circuit substrate by an electrically conductive via, which extends at least partially through the package. The package, which may include a material selected from a group consisting of glass and ceramics, includes a base and a cap sealed to the base. The metal inductor includes a metal layer patterned on at least one of the cap and base of the package. The base may also include first and second electrically conductive vias therein, which are electrically connected to first and second terminals of the inductor.

主权项

1. An integrated circuit device, comprising:
an integrated circuit substrate having an at least two piece package thereon comprising a base and a cap sealed to the base, said package having a sealed cavity therein and a patterned metal inductor and electrically conductive ground shield in the cavity, said inductor comprising a metal layer patterned on an upper surface of the base and having at least a first terminal electrically coupled to a portion of said integrated circuit substrate by an electrically conductive via, which extends at least partially through the package; wherein the cap has a concave-shaped recess therein that faces the inductor and the electrically conductive ground shield covers an entirety of the concave-shaped recess in the cap and is electrically coupled to a portion of said integrated circuit substrate by an electrically conductive ground via in the base.