| 发明名称 |
Semiconductor Package for Thermal Dissipation |
| 摘要 |
A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using materials that are different than the first external connections in order to provide a thermal pathway from the first package. In a particular embodiment the first external connections are solder balls and the second external connections are copper blocks. |
| 申请公布号 |
US2016358894(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615243694 |
申请日期 |
2016.08.22 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Jeng Shin-Puu;Yeh Der-Chyang;Chen Hsien-Wei;Hsieh Cheng-Chieh;Chiu Ming-Yen |
| 分类号 |
H01L25/065;H01L23/367;H01L23/31 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
an integrated fan out package; a first set of external connections bonded to a first side of the integrated fan out package; and a second set of external connections bonded to the first side of the integrated fan out package, wherein the second set of external connections has a higher thermal conductivity than the first set of external connections. |
| 地址 |
Hsin-Chu TW |
