发明名称 |
STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, AND/OR SYSTEMS EMPLOYING THE SAME |
摘要 |
An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound. |
申请公布号 |
US2016358893(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
US201615241452 |
申请日期 |
2016.08.19 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
KWON Heung-Kyu;NA Min-Ok;PARK Sung-Woo;PARK Ji-Hyun;PARK Su-Min |
分类号 |
H01L25/065;H01L23/48;H01L25/00;H01L23/00;H01L21/56;H01L23/31;H01L23/498 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
1. (canceled) |
地址 |
Suwon-si KR |