| 摘要 |
This semiconductor device is provided with: first elements (10 to 14) formed with a first component as a main component; second elements (20 to 24) formed with a second component as a main component; a heat sink (30) on which the first elements and the second elements are placed; a first joining layer (50) which electrically joins the first elements to the heat sink; a second joining layer (60) which electrically joins the second elements to the heat sink; and a molded resin (90) which covers and protects the first elements, the second elements and the heat sink. The physical sizes of the first elements and the second elements are set in such a way that the equivalent plastic strain increment of the first joining layer is greater than that of the second joining layer. By this means, in a semiconductor device provided with semiconductor elements formed using mutually different components, the elements can be thermally protected without the need to provide a temperature detecting means on the side on which the semiconductor elements formed using one of the components are provided. |
