| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite microball in which a stable and thick film which is 20μm or more can be formed into a sphere, and plating can be executed with spherical finished shape and satisfactory rolling performance, and a method and device for manufacturing this composition microball. SOLUTION: In this microball using copper as a core ball, the core ball has an uniform diameter which is 30μm or more and 120μm or less, and the microball has a solder plated layer in uniform thickness which is 20μm or more at one side of the outermost skin, and the outer diameter within the range of 50-200μm. In this composite microball, the core ball arranged at a cathode 27 side is rotated so that conduction/non-conduction can be conducted, and while a dummy ball whose diameter is 300-1,000μm or less is constituted so that while a non-plated core ball is formed within 5-20% (volumetric ratio) or less, ball adhesion during the film formation is canceled, and a uniform solder plated film is formed.
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