| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for sealing semiconductors which is in a liquid state and has a low viscosity at an ordinary temperature and therefore exerts an excellent handleability, does not lose the advantage, a long pot-life, of conventional liquid sealing materials, and yields a cured product having a low elasticity which shows an excellent reliability in terms of humidity resistance and heat resistance of semiconductors and does not allow coagulation, floating in the upper layer of liquids or phase separation, and a semiconductor device sealed using such liquid epoxy resin composition. SOLUTION: This liquid epoxy resin composition for sealing semiconductors contains (A) a cyanic ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or metal salt and (F) a gel silicone resin, wherein at least one of component (A) or component (B) is in a liquid state at a room temperature, and the weight ratios of each components are component (A)/component (B) = 0.76 to 1.43, component (C)/total composition = 0.60 to 0.95, 0.01 < component (F)/(total composition - component (C)) <0.3. A semiconductor device is prepared by sealing a semiconductor element using the liquid epoxy resin composition.
|
