| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition for sealing semiconductor elements, etc., which does not deteriorate its pot life, is cured within a shorter time compared to the conventional resin composition and provides a reliability comparable to that of the conventional resin systems, and a reliable semiconductor device having a high productivity. SOLUTION: A liquid sealing resin composition comprises (A) a liquid epoxy resin having two or more epoxy groups in average, (B) an aromatic amine hardener which is in the liquid state at an ordinary temperature, (C) an imidazole having a hydroxy group and (D) silica. Preferably, the aromatic amine hardener is an alkylated diaminodiphenylmethane. A semiconductor device is prepared by sealing a semiconductor element using the above-mentioned liquid sealing resin composition.
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