| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology capable of improving a characteristic of an electronic device. <P>SOLUTION: After a plurality of second through-holes 4e for a thermal via holes 4g are formed after closely laminating a plurality of green sheets 4c, thermal via holes 4g are formed by filling conductors 4h into the holes 4e, and after that, a ceramic multilayer wiring board 4 formed by a heat treatment is prepared. As there is no displacement of the holes 4g in each layer of the board 4 by assembling an RF module (the electronic device) with semiconductor chips and chip components mounted on the board 4, a narrow heat-transfer-path from the semiconductor chips can be eliminated to suppress variations in heat resistance in each board 4. Accordingly, variations in the electrical characteristic of the RF module are lowered to improve the characteristic. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
