| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device capable of suppressing its deformation while suppressing an insulating layer from peeling off a substrate. SOLUTION: The circuit device comprises a resin layer 2 formed on a substrate 1, fillers 20a, 20b, and 20c filling the resin layer 2, a conductive layer 3 formed on the resin layer 2, and an LSI chip 9 formed on the conductive layer 3. The average particle size of the fillers 20a, 20b, and 20c filling the resin layer 2 is controlled so that young' module at the part positioned on the substrate 1 side of the resin layer 2 is smaller than that positioned on the side opposite to the substrate 1 of the resin layer 2. COPYRIGHT: (C)2007,JPO&INPIT |
