| 摘要 |
PROBLEM TO BE SOLVED: To enable to wire a head chip with a furthermore higher reliability than the conventional case by applying it for example, to a line printer of an inkjet system in relation to a liquid delivering head and a liquid delivering apparatus. SOLUTION: A clearance is formed at a site of a bump 51 by sticking an insulating member 52 provided around the bump 51, and a substrate 37 for wiring is connected to the head chip 34. In addition, a thickness from the surface of the substrate of the head chip 34 to the surface of a base material on the head chip 34 side of the substrate 37 for wiring, is made thicker at the site of the bump 51 in comparison with the site of the insulating member 52. COPYRIGHT: (C)2007,JPO&INPIT
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