| 摘要 |
A printed circuit board embedded with electric elements and a method of manufacturing the same are provided to reduce a volume by not including a separate adhesive layer for embedding the electric elements. A printed circuit board includes a copper film stacked plate having through-holes(31) for accommodating electric elements(60,60'), an insulation layer and a conductor circuit layer alternatively stacked on the copper film stacked plate, and a via hole(70) connecting the conductor circuit layer with an electrode of the electric element. The insulation layer has a reinforcing substrate and a resin applied on a surface of the reinforcing unit. Plural through-holes are formed on the copper film stacked plate. |
