METHOD OF MANUFACTURING A THIN-FILM TRANSISTOR SUBSTRATE

摘要

A gate insulating layer, an active layer and a data metal film are sequentially formed on a substrate. A first photoresist pattern having a relatively small thickness in a channel forming area with respect to a thickness of the photoresist pattern not in the channel forming area is formed on the data metal film. The data metal film and the active layer are sequentially etched using the first photoresist pattern. The active layer is etched using the first photoresist pattern. The first photoresist pattern is dry etched using a gas mixture including a sulfur hexafluoride gas and an oxygen gas to form a second photoresist pattern with an opening formed in the channel forming area. The data metal film is then etched using the second photoresist pattern. Dry, wet or acid cleaning procedures used within the manufacturing method reduce formation of stringers in the substrate.