| 发明名称 |
Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate |
| 摘要 |
A semiconductor arrangement has a silicon body with a first surface and a second surface and a thick metal layer arranged on at least one surface of the silicon body. The thickness of the thick metal-layer is at least 10 micrometers (mum). |
| 申请公布号 |
US2008093729(A1) |
申请公布日期 |
2008.04.24 |
| 申请号 |
US20060551488 |
申请日期 |
2006.10.20 |
| 申请人 |
|
发明人 |
SIEPE DIRK;BAYERER REINHOLD |
| 分类号 |
H01L23/48;H01L21/58;H01L21/60;H01L23/15 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
