发明名称 |
BUILDUP PRINTED CIRCUIT BOARD |
摘要 |
A printed circuit board includes a first insulation layer that is formed of a resin material into which fiber cloth is embedded. A second insulation layer is formed of a resin material, and is stacked on a front surface of the first insulation layer on which a heating process has been performed. A conductive land is formed on a front surface of the second insulation layer. A via is provided in a through hole penetrating through the first insulation layer and the second insulation layer. The through hole is filled with a conductive material, and the via is connected to the conductive land.
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申请公布号 |
US2010018762(A1) |
申请公布日期 |
2010.01.28 |
申请号 |
US20090502268 |
申请日期 |
2009.07.14 |
申请人 |
FUJITSU LIMITED |
发明人 |
YOSHIMURA HIDEAKI;OZAKI NORIKAZU;IIDA KENJI;ABE TOMOYUKI |
分类号 |
H05K1/11;B23P23/00;H05K3/36 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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