| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for mounting a circuit component unit for a sheet-like circuit board, with less aging of conduction characteristics and no risk of positional deviation, and to provide a circuit component unit related to this mounting structure, and a recombination circuit device.SOLUTION: An intermediate substrate 140 of a circuit component unit is bonded removably onto a sheet-like circuit board 190 by bonding means (e.g., a double-sided adhesive sheet or an adhesive), while facing the contact 122 of an elastic contact member 120 to a corresponding pad 191 on the sheet-like circuit board 190 through the opening 141 thereof.SELECTED DRAWING: Figure 2 |
